This module from Finetech ( http://www.finetech.de ) can be used on the FINEPLACER®s Lambda and Pico, and heats the component from the top. In contrast to the hot gas reflow module, the heat is transferred to the chip via direct contact.
This module is designed especially for the thermocompression or ACF process. If it shall be used for reflow purposes, either balls with hard core must be used, or in case of soft balls the placement arm must have a mechanical stop for its z movement downwards.
Otherwise, the liquefied solder bumps would be pancaked by the weight of the placement arm and tool. In case of using soft balls we deliver a stop which can be adjusted using a micrometer screw.