DK Thermal Dolutions (www.dkthermal.co.uk) Metal Substrate Technology utilises the printed circuit board as a key constituent in heat removal from component devices. The thermal efficiency gained by using a metal backed board allows downsizing of designs and hardware removal. Electrical insulation between the copper and base metal is achieved using dielectric layers with high thermal conductivity.

The advantages of using metal substrate circuitry

- Power densities can be increased whilst component are kept cool, increasing life and durability
- Surface Mount Technology can remove manual assembly from the traditional heat sink, clip, sil-pad arrangement
- Dielectrics can be tailored to suit your thermal or insulation level requirements
- The circuits can be shaped drilled and formed, an advantage when compared to ceramic based product
- Cooling properties allow devices to be driven harder