Innovation starts with LED Engin`s (www.ledengin.com) Luxigen Platform, an emitter and lens or integrated module system. The small size, yet remarkably powerful output, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required.

The LuxiGen Platform provides designers and engineers the building blocks to create seamless lighting experiences with high power density designs- from innovative architectural spaces to specialty curing and industrial lighting sources its customers achieve several advantages by working with the LuxiGen Platform:

1. Gain access to the most advanced high-power LED packaging technology, emitters, and light source modules.

2. Achieve record product development time and accelerate their time to market through close collaboration with LED Engin`s fast-moving and highly talented technical team that supports customers as top priority.

3. Reduce light source size and cost by using high density, ultra-compact LED Engin products.

Experience it for yourself with our Luxline of replacement lamp and module products- all built exclusively with our Luxigen Platform.

System Economy
LuxiGen innovation begins with the patented high-power density package design. The multi-layer ceramic substrate is CTE matched with the die providing a stress-free environment to maximize power density and reliability. The unique die attach process minimizes thermal resistance allowing its products to be driven reliably at higher currents. These design features combine to enable our compact, multi-die, high flux density product families.

For its white products, the high precision phosphor deposition process improves color uniformity and enhances the lumen maintenance and color stability over time. The interlocking glass lens caps off the robust package design providing a barrier resistant to contamination and degradation.

Unique Packaging
LuxiGen innovation begins with the patented high-power density package design. The multi-layer ceramic substrate is CTE matched with the die providing a stress-free environment to maximize power density and reliability. The unique die attach process minimizes thermal resistance allowing our products to be driven reliably at higher currents. These design features combine to enable our compact, multi-die, high flux density product families.

For its white products, the high precision phosphor deposition process improves color uniformity and enhances the lumen maintenance and color stability over time. The interlocking glass lens caps off the robust package design providing a barrier resistant to contamination and degradation.

Details are available at http://www.ledengin.com/technology/platform