USA - Optomec (www.optomec.com) announced that Dr. Kurt Christenson, Sr. Applications Scientist, will present a paper titled “High-Density Attachment of HB-LED Die to Heat Sink Surfaces Using Aerosol Jet Printing” at the IMAPS Device Packaging Conference on March 7. The conference will be held from March 6-8th in Scottsdale, Arizona.
Dr. Christenson’s presentation will describe how an Aerosol Jet printer is used to directly attach LED die to heat sinks, rather than the current multi-layer package architectures. The direct attach approach offers many benefits, including: reduced thermal resistance, improved heat dissipation, increased power densities, smaller form factor and lower cost. Dr. Christenson will also discuss the use of Aerosol Jet as a replacement for conventional wirebond technology for top-side interconnects, and as an enabling solution for flip-chip configurations. For more information on Optomec’s Aerosol Jet solutions, click here.
Additionally, Dr. Christenson will give a poster presentation at the conference entitled “Aerosol Jet Printing of a Silver-Epoxy Conductive Adhesive for High-Density Applications”. In this session, Dr. Christenson will introduce a new conductive epoxy that has been specifically developed for use with the Aerosol Jet printing process and its fine-feature capabilities.
Together, this novel material and the Aerosol Jet system can be used to produce high-conductivity adhesive features for surface mount, and high-stress interconnect applications. Dr. Christenson will describe how Aerosol Jet’s non-contact capability can be used to print conductive features as small as 30um onto planar and 3-dimensional substrates, including into trenches with more than 1cm in depth. This presentation will cover the electrical, mechanical, and thermal properties of the new adhesive material, as well as the wide variety of printed patterns that can be created with Aerosol Jet systems.
Aerosol Jet printers have the unique ability to produce a wide range of electronic, structural and biological patterns onto almost any substrate. The proprietary process, which is completely different from ink jet, utilizes aerodynamic focusing to precisely deliver fluid and nano-material formulations that as required can be optionally post-treated with a highly focused laser or other sintering methods. The resulting patterns can have features that are less than 10 microns wide, with layer thicknesses from 10's of nanometers to several microns. Wide nozzle print heads are also available which enable efficient patterning of larger size features and surface coating applications.