LUMITECH develops COB LED modules in virtually every SPD and every luminous intensity. The bandwidths of the wavelengths used by LUMITECH range from visible colours to infrared (e.g. 950 nm). Different chips can be combined in any way desired and activated independently of each other.
COB LED modules by LUMITECH can be assembled with standard LED chips or high-power LED chips in edge widths of 350x350 μm to 1000x1000 μm, while in addition to the Face Up technology, the Flip Chip variant with submount is implemented. The operating currents range from a few mA to high-performance COB LED modules with 1000 mA.
The high luminosity of the high-performance COB LED modules by LUMITECH is achieved through unique packaging in the tightest space. This high-level packaging density of the LED chips allows for high intensities with homogeneous luminous field. LUMITECH thus achieves the greatest optical achievements for high-power LED applications.
Encapsulation & colour conversion
The unencased chip on the PCB is encapsulated with a Glob Top by automatic dispensing equipment. This protects the chip from external influences such as dust or moisture. Various base resins based on epoxy or silicone are used. For monochromatic LED applications, the encapsulation is done so as to be transparent.
In white light production by means of colour conversion, LUMITECH achieves white light with outstanding Colour Rendering Indexes (CRIs) using a potting material, which is mixed [filled] with phosphor, a colour conversion pigment. LUMITECH provides COB LED modules with white light in a bandwidth which ranges from reddish warm-white, e.g. the light of a candle, to a cold and bluish white. In addition to standard colour temperatures such as 2700K (warm-white) to 4200K (neutral white) to 6500K (cool white), we also offer customer-specific SPDs.
The Chip On Board design allows for optimal thermo management. This also makes for the extremely long service life of the COB LED modules. To satisfy the required mechanical, electronic and thermal requirements, we offer the PCB design in the following substrate materials:
FR4 PCB with through-connections
Metal core PCB
Intrinsically tied to the PCB design, LUMITECH takes into account the correct type of cooling, since heat that arises must be conducted toward the back via the PCB and/or subsequently via a heat sink. This ensures flawless operation, the superior long service life of the LEDs, the wavelength stability and the intensity stability.
Without optimal thermo management, the following situations may occur:
Exceeding the permissible junction temperature
Decrease in optical performance
Shifting of wavelength
Changes in brightness and colour
Destruction of an LED
If requested, the resistance of the COB LED modules against environmental influences at LUMITECH can be verified in the form of various simulation tests such as a test with defined moisture (climatic exposure test cabinet test), temperature cycle test or the wet high temperature operating life test.
Photometry, radiometry and colorimetry
To ensure that our COB LED modules are manufactured within the specified tolerances, photometric parameters such as luminous flux and colorimetric parameters such as the Colour Rendering Index (CRI) or the CIE colour coordinates are measured and documented.