Update : 2017.12.15 Fri 16:53
Display Plus
Manufacturing/Test
Indium showcases Indium3.2HF solder paste for fine feature printing at IWLPC 2017
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2017.10.11  23:26:29
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USA - Indium (www.indium.com) will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.

Indium’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).

Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
• Good response-to-pause
• A wide reflow profile window
• Outstanding slump resistance
• Excellent wetting capability
• Superior fine-pitch soldering ability

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.

For more information on Indium’s materials for SiP or Indium3.2HF Solder Paste, go to www.indium.com/SiP or visit Indium Corporation’s booth 39.

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