Netherlands & UK - IXYS (www.ixysuk.com) announces that its wholly owned UK subsidiary, IXYS UK Westcode, launched a new range of 4500 volt very high current fast recovery diodes (HP-sonic FRDs) with nominal operating currents from 1800 to 3000 amperes, to be used in conjunction with IXYS’ family of very high current press-pack IGBTs.
The new diodes incorporate IXYS UK’s most advanced die bonding technology, where the silicon die is bonded to a metallic disc, replacing older designs based on floating silicon. The new bonded die design offers a diode with improved thermal stability and very robust mechanical properties. The silicon is optimised with advanced processing to give an unrivalled rate of change of current capability to more than 5000 amperes per microsecond, while retaining a soft recovery characteristic and low switching losses.
The diodes are packaged in fully hermetic 26mm thick ceramic packages with copper electrodes, and are compatible for series clamping in the same stack as IXYS UKs range of very high current press-pack IGBTs. The 3000 ampere device has a 96mm die and the 2400 ampere device has a 91mm die. Both are packaged in an 85mm electrode package with an overall diameter of 125mm. The 1800 ampere device has an 83mm die and is packaged in a 75mm electrode package with an overall diameter of 112mm.
Parts number designations are as follows: 3000 ampere device, E3000EC45E, 2400 ampere device, E2400EC45E and 1800 ampere device, E1800TC45E. The two lower current devices will replace the older C series floating silicon products and the 3000 ampere device extends the range to cover the new 3000 ampere press-pack IGBT.
“These new diodes combine IXYS’s established and market leading HP-sonic FRD fast diode technology with our best practice silicon bonding technology. These advanced diodes will replace our older floating silicon devices and will offer the customer the ultimate in reliability,” commented Frank Wakeman, IXYS UK’s Marketing and Technical Support Manager.